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US Patent Issued to UTAC HEADQUARTERS on July 14 for "Plasma diced wafers and methods thereof" (Singaporean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,087, issued on July 14, was assigned to UTAC HEADQUARTERS PTE. LTD. (Singapore). "Plasma diced wafers and methods thereof" was invented by ... Read More


US Patent Issued to Nexperia on July 14 for "Film frame carrier for a curved wafer stage" (Dutch Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,088, issued on July 14, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Film frame carrier for a curved wafer stage" was invented b... Read More


US Patent Issued to Resonac on July 14 for "Adhesive sheet, production method for adhesive sheet, roll, and production method for connection structure" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,089, issued on July 14, was assigned to Resonac Corp. (Tokyo). "Adhesive sheet, production method for adhesive sheet, roll, and production ... Read More


US Patent Issued to Applied Materials on July 14 for "Susceptor for process chamber" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,090, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Susceptor for process chamber" was invented by Zhepe... Read More


US Patent Issued to NIPPON ELECTRIC GLASS on July 14 for "Support glass substrate and laminated substrate using same" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,091, issued on July 14, was assigned to NIPPON ELECTRIC GLASS Co. LTD. (Shiga, Japan). "Support glass substrate and laminated substrate usi... Read More


US Patent Issued to Tokyo Electron on July 14 for "Apparatus for processing substrate and method of transferring substrate" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,092, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Apparatus for processing substrate and method of transferring substra... Read More


US Patent Issued to Tokyo Electron on July 14 for "Method for creating product-like stressed surrogate test wafers" (New York Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,093, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Method for creating product-like stressed surrogate test wafers" was ... Read More


US Patent Issued to INGENTEC on July 14 for "Micro-LED wafer testing device and micro-LED wafer testing method" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,094, issued on July 14, was assigned to INGENTEC Corp. (Miaoli County, Taiwan). "Micro-LED wafer testing device and micro-LED wafer testing... Read More


US Patent Issued to Applied Materials on July 14 for "In-situ integrated wafer parameter detection system with remote plasma cleaning" (Singaporean, American Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,095, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "In-situ integrated wafer parameter detection system ... Read More


US Patent Issued to Korea Advanced Institute of Science and Technology on July 14 for "Method of manufacturing SOI wafer" (South Korean Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,096, issued on July 14, was assigned to Korea Advanced Institute of Science and Technology (Daejeon, South Korea). "Method of manufacturing... Read More